A typical application is the automated transfer to the Fabmatics Test Wafer Center (TWC). Open wafer cassettes can be handed over directly from the transport system, enabling fully automated identification, sorting, buffering, and preparation of test wafers – even in box based fab environments. This creates a seamless process from box opening to test wafer logistics, which until now has not been feasible in many existing fabs
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Fabmatics introduces the Box Opening Transfer Unit for box-based 200 mm semiconductor fabs
Fabmatics, a specialist in automated material flow and handling solutions for semiconductor manufacturing and part of the SCIO Automation Group, has expanded its portfolio with the Box Opening Transfer Unit.
The automation system addresses a key challenge in many established 200 mm fabs: the interface between protected box based transport and the controlled handling of open wafer cassettes at the tool interface.
In box based 200 mm fabs, HA200 boxes must be transported safely and remain closed throughout production, while open wafer cassettes are required for processing at the tools. The Box Opening Transfer Unit was developed specifically for this transfer point.
The system opens HA200 boxes directly on the transport system and hands over the wafer cassette to downstream handling or tool loading systems in a defined and reproducible transfer situation. The box itself remains entirely within the conveyor. This creates a clearly separated functional interface between transport and carrier handling – without any manual intervention.
A key advantage of this approach is its high level of compatibility with existing fab layouts. Instead of replacing established transport structures, the Box Opening Transfer Unit can be selectively integrated. Local buffer areas at the tool interface are eliminated, while material flow remains continuous and stable.
The focus is not on the opening process itself, but on a controlled and process reliable handover. This reduces the risk of particle contamination and mechanical impact and makes a significant contribution to process stability in classic 200 mm fabs.
Use Case: Automated Test Wafer Management in Box‑Based 200‑mm Fabs
With the Box Opening Transfer Unit, Fabmatics adds a key building block within the SCIO Automation Group’s portfolio for the step by step automation of existing 200 mm semiconductor fabs.
